Package_outline_dimensions_and_layout
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
Suggested Pad Layout
X2-DFN0806-3
Dimensions
Value
(in mm)
C
0.350
X
0.200
X1
0.450
X2
0.550
Y
0.375
Y1
0.475
Y2
1.000
A1
e
D1
E1
Pin#1
R0.075
K
D
E
b (2x)
A
A3
Seating Plane
L (2x)
X1
X2
Y2
Y1
Y
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
16 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN0808-4
X2-DFN0808-4
Dim
Min
Max
Typ
A
0.25
0.35
0.30
A1
0
0.04
0.02
A3
-
-
0.13
b
0.17
0.27
0.22
D
0.75
0.85
0.80
D2
0.15
0.35
0.25
E
0.75
0.85
0.80
E2
0.15
0.35
0.25
e
-
-
0.48
k
0.20
-
-
L
0.17
0.27
0.22
L1
0.02
0.12
0.07
z
-
-
0.05
All Dimensions in mm
Suggested Pad Layout
X2-DFN0808-4
Dimensions
Value
(in mm)
C
0.480
X
0.320
X1
0.300
X2
0.106
X3
0.800
Y
0.320
Y1
0.300
Y2
0.106
Y3
0.900
k
R0.05 TYP
A
A3
A1
Seating Plane
E
D
e
D2
E2
Z
b
L1
L
Pin #1 ID
X3
Y3
Y
X
C
Y1
X1
X2
Y2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.