Package_outline_dimensions_and_layout
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
N
-
-
0.35
Q
0.60 0.70 0.65
All Dimensions in mm
Suggested Pad Layout
SO-8EP
Dimensions
Value
(in mm)
C
1.270
X
0.802
X1
3.502
X2
4.612
Y
1.505
Y1
2.613
Y2
6.500
1
b
e
E1
A
A1
9° (All s
ide)
4°
±3
°
C
Q
N 4
5°
R 0
.1
7°
D
E0
E
L
Seating Plane
Gauge Plane
F
H
EXPOSED PAD
C
Y1
X1
X
Y
Y2
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
166 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SO-8EP
SO-8EP
Dim
Min
Max
Dim
Min
Max
A
-
1.75
e
1.27 Typ
A1
0.10
0.20
F1
0.685 Typ
A2
1.30
1.50
F2
0.713 Typ
A3
0.15
0.25
G
0.20 Typ
b
0.3
0.5
h
-
0.35
C1
1.7 Typ
L
0.62
0.82
C2
0.9 Typ
P1
2.05 Typ
D
4.85
4.95
P2
1.15 Typ
E
5.90
6.10
P3
2.15 Typ
E1
3.85
3.95
0
8
All Dimensions in mm
Suggested Pad Layout
SO-8EP
Dimensions
Value
(in mm)
C
1.270
X
0.802
X1
3.502
X2
4.612
Y
1.505
Y1
2.613
Y2
6.500
Gauge Plane
Seating Plane
Detail ‘A’
Detail ‘A’
E
E1
h
L
D
e
b
A2
A1
A
45°
7°~ 9°
A3
0
.2
5
4
C2
C1
Exposed Pad
Bottom View
C1
P1
P2
G
P3
F
F2
C
Y1
X1
X
Y
Y2
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS