Package_outline_dimensions_and_layout
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Z
-
-
0.385
Z1
-
-
0.885
All Dimensions in mm
Suggested Pad Layout
V-QFN4525-20
Dimensions
Value
(in mm)
C
0.500
X
0.330
X1
0.600
X2
3.200
X3
3.830
X4
4.800
Y
0.600
Y1
1.200
Y2
0.830
Y3
2.800
(Pin #1 ID)
D
E
b
E2
L
D2
e
Z
Z1
A
A3
Seating Plane
A1
X4
Y3
Y2
X3
X2
Y1
Y
X
C
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
157 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
QSOP-16
QSOP-16
Dim
Min
Max
Typ
A
1.55
1.73
-
A1
0.10
0.25
-
A2
1.40
1.50
-
b
0.20
0.30
-
c
0.18
0.25
-
D
4.80
5.00
-
E
5.79
6.20
-
E1
3.81
3.99
-
e
0.635 BSC
h
0.254
0.508
-
L
0.41
1.27
-
L1
1.03 REF
L2
0.254 BSC
R
0.0762
-
-
R1
0.0762
-
-
ZD
0.23 REF
θ
0°
8°
-
θ1
5°
15°
-
θ2
0°
-
-
All Dimensions in mm
Suggested Pad Layout
QSOP-16
Dimensions
Value
(in mm)
C
0.635
X
0.350
X1
4.795
Y
1.450
Y1
6.400
D
E1
E
ZD
E/2
E1/2
e
b
PIN 1
A2
A
A1
SEE DETAIL 'A'
L
L1
GAUGE PLANE
SEATING PLANE