Package_outline_dimensions_and_layout
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
POWERDI
®
5SP
POWERDI
®
5SP
Dim
Min
Max
Typ
A
0.75
b
4.30
4.50
4.40
c
0.155
0.195
D
5.70
5.90
5.80
D2
4.40
E
23.6
24.0
23.8
E1
5.70
5.90
5.80
E2
2.74
H1
0.19
0.21
0.20
J
0.20
K
0.30
L
9.00
L1
2.50
M
0.30
N
0
0.20
R
0.40
R1
0.15
R2
0.25
R3
0.40
W
1.66
2.06
θ
8º
12º
θ1
3º
7º
All Dimensions in mm
Suggested Pad Layout
Dimensions
Value
(in mm)
G
8.101
X
8.100
Y
5.100
b 2x
E
E1
D
E2
D2
W
E/2
TOP VIEW
BOTTOM VIEW
L 2x
N 8x
M 4x
8x cut faces are not
tin plated
R3
c
?
A
R2
R1
' ?1
L1
R
K 4x
J 4x
H1
Cutting Burr Side
X
Y
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
152 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
POWERDI
®
5SP (Type B)
POWERDI
®
5SP
Type B
Dim
Min
Max
Typ
A
0.75
b
4.30
4.50
4.40
c
0.155
0.191
D
5.70
5.90
5.80
D2
4.40
E
20.8
21.2
21.0
E1
5.70
5.90
5.80