Package_outline_dimensions_and_layout
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0.300
Y1
0.450
Y2
0.900
Y3
1.050
Y4
3.400
L
L1
L2
e
e1
b1
b
b
D
E
A
A
A3
PIN#1 ID
Y1
X2
X1
Y
C1
C
X
Y2
Y3
Y4
X3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
154 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN4040-16 (Type C)
U-QFN4040-16
Type C
Dim Min Max Typ
A
0.57 0.63 0.60
A1
0
0.05 0.02
A3
-
-
0.15
b
0.25 0.35 0.30
D
3.95 4.05 4.00
D2
1.04 1.24 1.14
E
3.95 4.05 4.00
E2
1.01 1.21 1.11
e
-
-
0.65
K
-
-
0.30
K1
-
-
0.32
K2
-
-
0.38
L
0.35 0.45 0.40
All Dimensions in mm
Suggested Pad Layout
U-QFN4040-16 (Type C)
Dimensions
Value
(in mm)
C
0.650
X
0.400
X1
2.075
X2
0.550
X3
2.075
X4
4.400
Y
0.650
Y1
0.400
Y2
1.225
Y3
2.075
Y4
0.550
Y5
4.400
D
E
b
L
A
A1
A3
e
K
K
D2(4x)
E2(4x)
Pin #1 ID
C 0.2
K2
K1
1
1
Y2
Y3
X3
Y5
X1
C
Y (4x)
X (8x)
X2 (8x)
X4
Y1 (8x)
Y4 (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.