Package_outline_dimensions_and_layout
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
PowerDI5060-8 (Type C)
PowerDI5060-8 (Type C)
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0
0.05
0.02
b
0.33
0.51
0.41
b1
0.300 0.366 0.333
b2
0.20
0.35
0.25
c
0.23
0.33
0.277
D
5.15 BSC
D1
4.85
4.95
4.90
D2
1.40
1.60
1.50
D3
-
-
3.98
E
6.15 BSC
E1
5.75
5.85
5.80
E2
3.56
3.76
3.66
e
1.27BSC
k
-
-
1.27
k1
0.56
-
-
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.05
0.20
0.175
L4
-
-
0.125
M
3.50
3.71
3.605
x
-
-
1.400
y
-
-
1.900
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
PowerDI5060-8 (Type C)
Dimensions
Value
(in mm)
C
1.270
G
0.660
G1
0.820
X
0.610
X1
3.910
X2
1.650
X3
1.650
X4
4.420
Y
1.270
Y1
1.020
Y2
3.810
Y3
6.610
DETAIL A
0(4x)
Seating Plane
A1
c
e
01(4x)
D1
E1
D
E
1
y
x
Ø1.000 Depth 0.07±0.030
A
DETAIL A
L
k
M
L1
D2
La
E2
b(8x)
e/2
1
b1(8x)
b2(2x)
D2
k1
D3
L4
1
8
Y3
X4
Y1
Y2
X1
G1
X
C
Y(4x)
G
X2
X3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.