Package_outline_dimensions_and_layout
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1.66
1.61
e
--
--
0.65
L
0.35
0.45
0.40
L1
--
--
0.39
z
--
--
0.515
All Dimensions in mm
Suggested Pad Layout
POWERDI
®3333-8
Dimensions
Value
(in mm)
C
0.650
G
0.230
X
0.420
X1
0.420
X2
2.370
Y
0.700
Y1
3.700
Y2
1.850
Y3
2.250
D
D2
E
e
b
E2
A
A3
Pin #1 ID
Seating Plane
L(4x)
A1
L1(3x)
b2(4x)
z(4x)
1
X2
Y1
X
Y
C
Y2
Y3
X1
G
1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
145 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
POWERDI
®
3333-8(Type B)
POWERDI
®3333-8
Type B
Dim Min
Max
Typ
A
0.75
0.85
0.80
A1
0
0.05
0.02
A3
0.203
b
0.27
0.37
0.32
b2
0.20
D
3.25
3.35
3.30
D1
2.55
2.66
2.61
D2
1.74
1.84
1.79
e
0.65
E
3.25
3.35
3.30
E1
1.14
1.24
1.19
E2
0.61
0.71
0.66
K1
0.41
K2
0.38
L
0.35
0.45
0.40
L1
0.25
Z
0.515
All Dimensions in mm
Suggested Pad Layout
POWERDI
®3333-8 (Type B)
Dimensions
Value (in mm)
C
0.650
G
0.230
X
0.420
X1
2.370
X2
0.420
X3
1.890
X4
2.710
Y
0.700
Y1
0.400
Y2