Package_outline_dimensions_and_layout
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MSOP8-EP
Dimensions
Value
(in mm)
C
0.650
G
0.450
X
0.450
X1
2.000
Y
1.350
Y1
1.700
Y2
5.300
1
D
A
A1
A2
E
e
y
x
Seating Plane
Gauge Plane
0.
25
L
4X1
0°
4X1
0°
D
8Xb
See Detail C
Detail C
c
a
E1
E3
A3
D1
E2
X
C
Y
Y2
Y1
X1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
139 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MSOP-10
MSOP-10
Dim Min Max
Typ
a
0
8°
4°
A
-
1.10
-
A1
0.05 0.15 0.10
A
0.75 0.95 0.86
b
0.17 0.27 0.20
c
0.08 0.23 0.15
D
2.95 3.05 3.00
e
-
-
0.50
E
4.80 5.00 4.90
E1
2.95 3.05 3.00
L
0.40 0.80 0.60
All Dimensions in mm
Suggested Pad Layout
MSOP-10
Dimensions
Value
(in mm)
X
0.30
Y
1.4
C1
4.4
C2
0.50
1
D
A
A1
A2
E
e
Y
X
D
b (10X)
Seating Plane
Gauge Plane
0.25
L
4X1
0°
4X1
0°
c
a
E1
E3
A3
X
Y
C 1
C 2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.