Package_outline_dimensions_and_layout
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D
2.90 3.10 3.00
E
4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e
-
-
0.65
L
0.40 0.80 0.60
a
0°
8°
4°
x
-
-
0.750
y
-
-
0.750
All Dimensions in mm
Suggested Pad Layout
MSOP-8
Dimensions
Value
(in mm)
C
0.650
X
0.450
Y
1.350
Y1
5.300
A
A1
A2
e
Seating Plane
Gauge Plane
0.25
L
4X10°
4X
10
°
See Detail C
Detail C
c
a
E1
E3
A3
1
E
y
x
D
b
X
C
Y
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
138 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
MSOP-8EP
MSOP-8EP
Dim Min
Max
Typ
A
-
1.10
-
A1
0.05 0.15
0.10
A2
0.75 0.95
0.86
A3
0.29 0.49
0.39
b
0.22 0.38
0.30
c
0.08 0.23
0.15
D
2.90 3.10
3.00
D1
1.60 2.00
1.80
E
4.70 5.10
4.90
E1
2.90 3.10
3.00
E2
1.30 1.70
1.50
E3
2.85 3.05
2.95
e
-
-
0.65
L
0.40 0.80
0.60
a
0°
8°
4°
x
-
-
0.750
y
-
-
0.750
All Dimensions in mm
Suggested Pad Layout