Package_outline_dimensions_and_layout
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Suggested Pad Layout
U-DFN6040-12
Dimensions
Value
(in mm)
C
0.500
G
0.650
G1
0.350
X
0.250
X1
1.075
X2
1.275
X3
2.750
Y
0.400
Y1
1.150
Y2
1.000
Y3
2.300
A3
A1
Seating Plane
D
E
e
L
b
Z
A
D1
E1
D2
E2
X3
X1
Y2
Y3
Y
C
X
Pin1
X2
Y1
G1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
128 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN6040-22
V-DFN6040-22
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
0.203 BSC
b
0.20
0.30
0.25
D
5.95
6.05
6.00
D2
3.82
4.02
3.92
D2a
1.10
1.30
1.20
E
3.95
4.05
4.00
E2
2.44
2.64
2.54
e
0.50 BSC
L
0.35
0.45
0.40
Z
-
-
0.375
All Dimensions in mm
Suggested Pad Layout
V-DFN6040-22
Dimensions
Value
(in mm)
C
0.500
G
0.280
G1
0.200
X
0.350
X1
1.330
X2
4.050
X3
5.660
Y
0.650
Y1
0.270
Y2
4.400
A
A1
A3
Seating Plane
D
Z
b
e
L
E2
PIN#1 I.D.
C0.3
E
D2
D2a
X3
Y2
Y1
X1
X2
X
Y
C
G1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.