Package_outline_dimensions_and_layout
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0.30
0.25
D
1.90
2.10
2.00
D2
1.40
1.60
1.50
e
-
-
0.50
E
4.90
5.10
5.00
E2
2.80
3.00
2.90
L
0.35
0.65
0.50
Z
-
-
0.375
All Dimensions in mm
Suggested Pad Layout
W-DFN5020-6
Dimensions
Value (in
mm)
C
0.50
G
0.35
X
0.35
X1
0.90
X2
1.80
Y
0.70
Y2
1.60
Y3
3.20
e
D
A3
A1
A
E
D2
E2
L
Z
b
Pin 1 ID
Y3
X2
X1
Y2
X
C
Y
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
124 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN5045-12
V-DFN5045-12
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
0.02
A3
-
-
0.203
b
0.25
0.35
0.30
D
4.95
5.05
5.00
D2
1.80
2.00
1.90
E
4.45
4.55
4.50
E2
0.90
1.10
1.00
e
-
-
0.80
k
-
-
0.50
k1
-
-
0.50
k2
-
-
0.50
L
0.45
0.55
0.50
z
-
-
0.35
All Dimensions in mm
Suggested Pad Layout
V-DFN5045-12
Dimensions
Value (in mm)
C
0.800
X
0.400
X1
2.100
X2
4.500
Y
0.700
Y1
1.200
Y2
2.700
Y3
4.800
D2(4x)
D
A3
A
k
k1
k2
L
b
z
e
E
E2(4x)
A1
Seating Plane