Package_outline_dimensions_and_layout
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
U-DFN4030-12 (Type C)
U-DFN4030-12
Type C
Dim Min Max
Typ
Dim Min Max Typ
A
0.57 0.63 0.60
E1 1.60 1.80 1.70
A1
0
0.05 0.02
E2 0.88 1.08 0.98
A3
0.015
E3 0.29 0.49 0.39
B
0.20 0.30 0.25
E4 1.60 1.80 1.70
D
3.95 4.05 4.00
e
0.50
D1 0.74 0.94 0.84
L
0.30 0.40 0.35
D2 1.00 1.20 1.10
L1 0.05 0.15 0.10
D3 1.00 1.20 1.10
K1
0.30
D4 0.84 1.04 0.94
K2
0.33
E
2.95 3.05 3.00
Z
0.23
All Dimensions in mm
Suggested Pad Layout
U-DFN4030-12 (Type C)
Dimensions
Value
(in mm)
C
0.500
G
0.225
X
0.300
X1
0.800
X2
0.890
X3
0.990
X4
1.150
X5
3.590
Y
0.600
Y1
0.600
Y2
0.440
Y3
1.030
Y4
1.750
Y5
3.400
Y6
0.275
D2
E2
D4
E4
E3
D3
Z
K1
K2
R0.
150
Pin1
A
A3
D
E
b (12x)
L1
A1
e
L
D1
E1
1
Y4
Y
Y5
X (12x)
Y3
X4
X5
X1
X2
X3
Y2
Y6
G
Y1 (6x)
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.