Package_outline_dimensions_and_layout
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1.60
1.50
e
-
-
0.50
L
0.35
0.45
0.40
Z
-
-
0.625
All Dimensions in mm
Suggested Pad Layout
U-QFN3030-16(Type B)
Dimensions
Value
(in mm)
C
0.500
G
0.150
G1
0.150
X
0.350
X1
1.800
Y
0.600
Y1
1.800
Side View
A
A3
A1
Bottom View
D
D2
E
e
b (16x)
L (16x)
E2
(Pin #1 ID)
Z (8x)
0.450
R0.2
00
X (16x)
Y (16x)
C
Y1
X1
G1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
111 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN3030-20
U-QFN3030-20
Dim
Min
Max
Typ
A
0.57 0.63 0.60
A1
0.00 0.05 0.02
A3
-
-
0.15
b
0.16 0.26 0.21
D
2.95 3.05 3.00
D2
1.70 1.90 1.80
E
2.95 3.05 3.00
E2
1.70 1.90 1.80
e
-
-
0.40
L
0.30 0.40 0.35
z
-
-
0.595
All Dimensions in mm
Suggested Pad Layout
U-QFN3030-20
Dimensions Value (in mm)
C
0.400
X
0.250
X1
1.900
X2
3.300
Y
0.550
Y1
1.900
Y2
3.300
D
D2
E
e
L
E2
A
A3
(Pin #1 ID)
Seating Plane
z
e
A1
b
C'0.2
X45°
X
C
Y
X1
Y1
Y2
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS