Package_outline_dimensions_and_layout
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3.050
3.00
D2
0.90
1.10
1.00
D2a
0.90
1.10
1.00
E
2.95
3.050
3.00
E2
1.72
1.92
1.82
E2a
1.72
1.92
1.82
e
0.65BSC
L
0.27
0.38
0.33
La
0.15
0.25
0.20
k
0.35 TYP
z
0.40 BSC
All Dimensions in mm
Suggested Pad Layout
V-DFN3030-8 Type J
Dimensions
Value
(in mm)
C
0.650
G
0.250
G1
0.550
X
0.350
X1
1.100
X2
1.100
X3
1.225
X4
2.375
Y
0.530
Y1
0.300
Y2
1.920
Y3
1.920
Y4
1.650
Y5
3.300
A
A1
A3
Seating Plane
D
E
e
z
E/2
b
D/2
D2a
D2
E2a
E2
k
La
L
PIN1# ID
Y5
X4
C
Y3
Y1
Y
X
X1
X2
Y2
G1
G
X3
Y4
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
103 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type K
V-DFN3030-8
(Type K)
Dim
Min
Max
Typ
A
0.77
0.83
0.80
A1
0
0.05
0.02
A3
0.20BSC
b
0.35
0.45
0.40
D
2.95
3.050
3.00
D2
2.30
2.50
2.40
D2a
2.30
2.50
2.40
E
2.95
3.050
3.00
E2
0.42
0.62
0.52
E2a
0.89
0.109
0.99
e
0.65BSC
k
-
-
0.35
L
0.30
0.40
0.35
z
0.325BSC
All Dimensions in mm