Package_outline_dimensions_and_layout
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Rev. 90
98 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-8 (Type D)
U-DFN3030-8
Type D
Dim
Min
Max
Typ
Dim
Min
Max
Typ
A
0.570 0.630
0.600
E
2.950 3.075 3.000
A1
0
0.050
0.020
E1
1.800 2.000 1.900
A3
-
-
0.150
E2
0.290 0.490 0.390
b
0.290 0.390
0.340
E3
0.175 0.375 0.275
D
2.950 3.075
3.000
E4
-
-
0.550
D1
2.175 2.375
2.275
E5
-
-
0.815
D2
0.980 1.180
1.080
E6
-
-
0.150
D3
0.105 0.305
0.205
E7
-
-
0.135
D4
-
-
0.925
L
0.300 0.40 0.350
D5
-
-
1.330
Z
-
-
0.355
e
-
-
0.650
All Dimensions in mm
A
A1
A3
Seating Plane
D
E
D1
D2
E2
D3
E3
e
Z
D/2
E/2
b(8X)
D4
D5
E4
L
E6
E7
E1
E5
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
99 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-8 (Type E)
U-DFN3030-8
Type E
Dim Min
Max
Typ
A
0.57
0.63
0.60
A1
0
0.05
0.02