Package_outline_dimensions_and_layout
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-
-
0.850
D2d
-
-
0.320
D2e
-
-
0.400
E
1.95
2.075
2.00
E2
-
-
0.200
E2a
-
-
0.450
e
-
-
0.60
L
0.25
0.35
0.30
La
-
-
0.460
Lb
-
-
0.550
Lc
-
-
0.548
Z
0.175 0.225
0.20
All Dimensions in mm
Suggested Pad Layout
V-DFN3020-10
Dimensions
Value
(in mm)
C
0.600
G, G2, G3
0.150
G1
0.240
X
0.300
X1
0.950
X2
0.500
X3
0.600
X4
1.100
X5
0.500
X6
0.420
Y
0.500
Y1
0.650
Y2
0.560
Y3
0.550
Y4, Y5, Y6
0.300
Y7
0.650
Y8, Y9
0.300
Y10
0.560
Y11
2.300
D2
E2
R0.1
50
E2
D2a
E2
E2
E2
D2c
D2e
D2d
D2b
E2a
E
b(10x)
L(6x)
Z(4x)
D
(Pi
n #1 ID
)
e
Lc
La
Lb
La
A
A1
A3
Seating Plane
C
G
Y11
G2
X(10x)
Y(6x)
Y2
Y10
X4
X3
Y3
X1
Y8
Y9
X5
X6
Y6
G1
Y4
Y5
X2
G3
Y7
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
92 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3020-14
V-DFN3020-14
Dim Min Max Typ
A
0.77 0.83 0.80
A1
0
0.05 0.02
A3
-
-
0.15
b
0.15 0.25 0.20
D
2.95 3.05 3.00
D2 2.40 2.60 2.50