Package_outline_dimensions_and_layout
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Rev. 90
89 of 316
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
V-DFN3020-8 (Type P)
Suggested Pad Layout
V-DFN3020-8 (Type P)
D
E
e
b
L
A
A1
A3
(Pin #1 ID)
Seating Plane
D2
E2b
z
D2b
E2
E2a
D2a
z1
k2
k3
k1
k
X4
X5
C
Y3
Y(6x)
X(6x)
X3
X2
Y1
Y2
X1
G2
G1
G
V-DFN3020-8
(Type P)
Dim
Min
Max
Typ
A
0.77
0.83
0.80
A1
0.00
0.05
0.02
A3
-
-
0.152
b
0.25
0.35
0.30
D
2.95
3.05
3.00
D2
0.38
0.58
0.48
D2a
0.34
0.54
0.44
D2b
0.85
1.05
0.95
E
1.95
2.05
2.00
E2
0.70
0.90
0.80
E2a
1.08
1.28
1.18
E2b
0.70
0.90
0.80
e
-
-
0.65
k
-
-
0.11
k1
-
-
0.30
k2
-
-
0.28
k3
-
-
0.28
L
0.25
0.35
0.30
z
-
-
0.375
z1
-
-
0.195
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.650
G
0.180
G1
0.180
G2
0.200
X
0.400
X1
0.580
X2
1.050
X3
0.540
X4
2.350
X5
2.530
Y
0.500
Y1
0.900
Y2
0.900
Y3
2.300
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
90 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout