Package_outline_dimensions_and_layout
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0.100
G2
0.150
G3
0.830
G4
0.115
G5
0.135
G6
0.170
G7
0.500
G8
0.500
R
0.150
X
0.500
X1
1.375
X2
1.225
X3
1.175
Y
1.980
Y1
1.015
Y2
0.715
Y3
0.650
E
E3
D3
E2
D2
L
D
E1
D1
Side View
Bottom View
A1
A3
e
b
Z
H
M
I
K
A
J
Y
X (4x)
C
Y3 (2x)
Y2
Y1
G1
G3
G4
R
G7
G8
X3
G5
X1
X2
G2
G6
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
94 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN3030-6
U-DFN3030-6
Dim Min
Max
Typ
A
0.57
0.63
0.60
A1
0
0.05
0.02
A3
-
-
0.15
b
0.35
0.45
0.40
D
2.95
3.05
3.00
D2
2.25
2.45
2.35
E
2.95
3.05
3.00
E2
1.48
1.68
1.58
e
-
-
0.95
L
0.35
0.45
0.40
Z
-
-
0.35
All Dimensions in mm
Suggested Pad Layout
U-DFN3030-6
Dimensions
Value
(in mm)
C
0.950
X
0.500
X1
2.400
X2
2.550
Y
0.600
Y1
1.780
Y2
3.300
D
D2
E
e
b
L
E2
A
A3
(Pin #1 ID)
Seating Plane
Z(4x)
A1
45°(0.35*0.35)
Y2
X1
X
C-0.409
X2
Y1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.