Package_outline_dimensions_and_layout
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X4
1.250
X5
2.750
Y
0.675
Y1
0.550
Y2
0.850
Y3
0.755
Y4
1.455
Y5
1.000
Y6
0.650
Y7
1.455
Y8
2.300
e
b
D
D4 (2x)
E4
(2x)
L2
L1
L (4x)
D2
D1
E2
E1
E
Z (4x)
E3
D3
A
A1
A3
X1 (6x)
Y1
Y (4x)
Y3
X2
Y7
Y6
X4
X3
Y5
Y4
X (2x)
C
Y2
Y8
X5
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
88 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3020-8 (Type N)
V-DFN3020-8
(Type N)
Dim Min Max
Typ
A
0.77
0.83
0.80
A1
0
0.05
0.02
A3
-
-
0.203
b
0.24 0.34
0.29
D
2.95 3.05
3.00
D2
0.84 1.04
0.94
e
-
-
0.65
E
1.95 2.05
2.00
E2
0.70 0.90
0.80
L
0.27 0.37
0.32
L1
0.15 0.25
0.20
K
-
-
0.68
Z
-
-
0.38
All Dimensions in mm
Suggested Pad Layout
V-DFN3020-8
(Type N)
Dimensions
Value
(in mm)
C
0.650
G
0.580
X
0.390
X1
1.040
X2
2.340
Y
0.520
Y1
0.900
Y2
0.300
Y3
2.300
D
E
b
A
A1
A3
Seating Plane
E2
e
L1
L
K
Z(4x)
(Pin #1 ID)
D2
X2
Y3
C
Y
X
G
Y1
X1
Y2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.