Package_outline_dimensions_and_layout
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Suggested Pad Layout
V-DFN3030-8 Type K
Dimensions
Value
(in mm)
C
0.650
G
0.195
G1
0.200
X
0.450
X1
2.550
Y
0.450
Y1
1.044
Y2
0.566
Y3
0.389
Y4
0.089
Y5
1.150
Y6
3.200
A
A1
A3
Seating Plane
D
E
e
Z
D/2
E/2
b
L
D2
E2
D2a
E2a
k
Y6
X1
X
Y
C
Y1
Y2
Y3
G
G1
Y5
Y4
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
104 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
V-DFN3030-8 Type M
V-DFN3030-8
(Type M)
Dim
Min
Max
Typ
A
0.75 0.85 0.80
A1
0.00 0.05 0.02
A3
0.203 BSC
b
0.27 0.37 0.32
D
2.95 3.05 3.00
D2
2.50 2.70 2.60
D2a 2.50 2.70 2.60
e
0.65 BSC
E
2.95 3.05 3.00
E2
0.59 0.79 0.69
E2a
0.59 0.79 0.69
L
0.30 0.40 0.35
k
0.180 0.280 0.230
k1
0.205 0.305 0.255
z
0.365 BSC
All Dimensions in mm
Suggested Pad Layout
V-DFN3030-8 Type M
Dimensions Value (in mm)
C
0.650
C1
0.688
G
0.260
G1
0.180
G2
0.325
X
0.370
X1
0.470
X2
0.545
X3
2.700
X4
2.470