Package_outline_dimensions_and_layout
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Rev. 90
109 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN3030-16 (Type US)
W-DFN3030-16
(Type US)
Dim
Min
Max
Typ
A
0.70 0.80 0.75
A1
0
0.05 0.02
A3
0.20 REF
b
0.18 0.30 0.25
D
2.90 3.10 3.00
D2
1.55 1.80 1.70
e
0.50 BSC
E
2.90 3.10 3.00
E2
1.55 1.80 1.70
L
0.30 0.50 0.40
All Dimensions in mm
Suggested Pad Layout
W-DFN3030-16 (Type US)
Dimensions Value (in mm)
C
0.500
X
0.350
X1
0.570
X2
1.800
X3
3.300
Y
0.570
Y1
1.800
Y2
3.300
D2
E2
e/2
b
L
A
A3
Pin #1 ID
(Laser Mark)
Seating Plane
E/2
A1
D
E
e
D/2
X2
Y1
X3
Y2
C
Y
X
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
110 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-QFN3030-16 (Type B)
U-QFN3030-16
Type B
Dim
Min
Max
Typ
A
0.55
0.65
0.60
A1
0
0.05
0.02
A3
-
-
0.15
b
0.18
0.28
0.23
D
2.95
3.05
3.00
D2
1.40
1.60
1.50
E
2.95
3.05
3.00
E2
1.40