Package_outline_dimensions_and_layout
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
U-DFN4030-12 (Type B)
U-DFN4030-12
Type B
Dim Min Max Typ Dim Min Max Typ
A
0.55 0.65 0.60
e
-
-
0.50
A1
0.00 0.05 0.02
E1 1.51 1.71 1.61
A3
-
-
0.15
E2 0.35 0.55 0.45
B
0.20 0.30 0.25
E3 0.74 0.94 0.84
D
3.95 4.05 4.00
E4 0.30 0.50 0.40
D1
1.52 1.72 1.62
E5 0.15 0.35 0.25
D2
0.96 1.16 1.06
L
0.45 0.55 0.50
D3
0.70 0.90 0.80
L1 0.30 0.40 0.35
D4
0.65 0.85 0.75
L2 0.72 0.82 0.77
E
2.95 3.05 3.00
Z
-
-
0.625
All Dimensions in mm
Suggested Pad Layout
U-DFN4030-12 (Type B)
Dimensions
Value
(in mm)
C
0.500
X
0.350
X1
1.160
X2
0.900
X3
1.720
X4
0.850
X5
3.700
Y
0.700
Y1
0.870
Y2
0.500
Y3
0.550
Y4
0.350
Y5
1.710
Y6
0.940
Y7
3.300
E5
E1
L2
E2
E
E3
E4
L (5x)
L1 (6x)
D4 (4x)
e
D
Z (4x)
b (12x)
D1 (2x)
D3
D2 (2x)
A
A1
A3
Y7
X5
C
X (12X)
Y5 (2x)
X1(2x)
X3 (2x)
Y
Y3
X2
Y6
Y2
Y4
X4
1
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.