design_for_dust
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DESIGN
APRIL 2008
47
TEST & MEASUREMENT WORLD www.tmworld.com
Just because you work in an air-condi-
tioned office or a temperature-con-
trolled lab and breathe filtered air
doesn’t mean your equipment won’t
suffer from indoor air pollution. Dust
and moisture still accumulate on
printed-circuit boards (PCBs) inside product en-
closures, increasing the chance of an electrical
breakdown (arc-over) between circuits. Electrical
breakdown can put users at shock risk or can result
in a product fire. To guard against the negative ef-
fects of airborne pollution, you must design prod-
ucts to meet insulation requirements.
Air is a mixture of nitrogen, oxygen, carbon di-
oxide, argon, and trace gases. When you add dust
(particulate matter) and water (vapor), you get in-
door air pollution. Studies from state and federal
environmental agencies show that indoor pollution
levels can sometimes range between two and five
times higher than outdoor levels (Refs. 1, 2).
Most indoor dust pollution comes from build-
ing materials such as airborne fiberglass, partition
fibers, and carpets as well as office machines, copi-
ers, and smoke. The insides of computers in service
for only a few months can often be coated with
layers of dust, which can cause electrical shorts
(Figure 1). Metallic dust particles present in in-
dustrial environments cause more trouble because
they’re more conductive than typical office dust.
Conductive dust sources include motors, paper
shredders, conveyors, and manufacturing and con-
struction processes. Electronic equipment manu-
facturers often suggest cleaning internal PCBs and
air filters in products to prevent dust buildup.
Water pollution also raises safety risks. Water vapor
can come from many sources including cleaning
products, air conditioners, water coolers, carpets, and
fumes, and from the heating of food and beverages.
Your breath contains hundreds of drops of water
vapor, which you can see form when you breathe
on a cold pair of eyeglasses. One person’s breathing
can produce 1⁄4 cup of water per hour.
Condensation coats the surface of electrical cir-
cuitry and can saturate dust coatings. Moisture can
BY DAVID LOHBECK, NATIONAL INSTRUMENTS
PRODUCT SAFETY
for
DUST AND WATER VAPOR on electronic components
can pose risks to product users, so design your products to
resist the shorts and shocks that can result from buildup.
PRODUCT SAFETY
increase conductivity between electrical
circuits, which can cause short circuits
resulting in product damage, fire, or elec-
trical shock (Ref. 3).
Safety standards address
pollutionAlthough modern buildings use air-filtra-
tion systems, dust and water will still build
up over time. Product safety standards take
air pollution into account, and by design-
ing your product to comply with these
standards, you will minimize safety risks.