Package_outline_dimensions_and_layout
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
POWERDI
®
5060-8
POWERDI
®
5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
b
0.33
0.51
0.41
b2
0.200
0.350
0.273
b3
0.40
0.80
0.60
c
0.230
0.330
0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
3.70
4.10
3.90
D3
3.90
4.30
4.10
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E3
3.99
4.39
4.19
e
1.27 BSC
G
0.51
0.71
0.61
K
0.51
L
0.51
0.71
0.61
L1
0.100
0.200
0.175
M
3.235
4.035
3.635
M1
1.00
1.40
1.21
Θ
10º
12º
11º
Θ1
6º
8º
7º
All Dimensions in mm
Suggested Pad Layout
POWERDI
®5060-8
Dimensions
Value (in mm)
C
1.270
G
0.660
G1
0.820
X
0.610
X1
4.100
X2
0.755
X3
4.420
X4
5.610
Y
1.270
Y1
0.600
Y2
1.020
Y3
0.295
Y4
1.825
Y5
3.810
Y6
0.180
Y7
6.610
D1
E1
A
L
K
M
L1
D2
G
E2
Detail A
0(4X)
A1
c
e
D
E
1
Detail A
b (8X)
e/2
1
01 (4X)
M1
b2 (4X)
b3 (4X)
E3
D3
Y7
X3
Y2
Y5
X1
G1
X
C
Y(4x)
G
X2
Y3
Y4
Y6
X4
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.