Package_outline_dimensions_and_layout
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Rev. 90
150 of 316
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
PowerDI5060-8 (Type D)
Suggested Pad Layout
D1
E1
A
L
k
M
L1
D2
La
E2a
DETAIL A
0(4x)
Seating Plane
A1
c
e
D
E
1
DETAIL A
b(8x)
e/2
1
01(4x)
M1
b2(4x)
Ø0.880 Depth 0.07±0.030
D2
b3(4x)
k1
E2
PowerDI5060-8
(Type D)
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0.00
0.05
0.02
b
0.33
0.51
0.41
b2
0.200 0.350 0.273
b3
0.48
0.88
0.68
c
0.230 0.330 0.277
D
5.15 BSC
D1
4.70
5.10
4.90
D2
1.45
1.85
1.65
E
6.15 BSC
E1
5.60
6.00
5.80
E2
3.28
3.68
3.48
E2a
3.99
4.39
4.19
e
1.27BSC
k
0.51
-
-
k1
0.60 BSC
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.10
0.20
0.175
M
3.235 4.035 3.635
M1
1.00
1.40
1.21
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
Dimensions
Value
(in mm)
C
1.270
G
0.820
X
0.610
X1
4.420
X2
5.610
Y
1.270
Y1
0.180
Y2
0.600
Y3
1.825
Y4
3.810
Y5
6.610
Y5
X1
Y4
G
X(8x)
C
Y(4x)
Y2
Y3
Y1
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
151 of 316