Package_outline_dimensions_and_layout
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Rev. 90
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Package Outline Dimensions
Suggested Pad Layout
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Package Outline Dimensions
PDIP-16
A2
A
L
A1
b2
b
E1
D
c
e
E2b
A3
E2a
E2c
PDIP-16
Dim
Min
Max
Nom
A
3.60
4.00
3.80
A1
0.51
-
A2
3.20
3.40
3.30
A3
1.47
1.57
1.52
b
0.44
0.53
--
b2
1.52BSC
c
0.25
0.31
--
D
18.90 19.30 19.10
E1
6.15
6.55
6.35
E2a
7.62 BSC
E2b
7.62
9.30
--
E2c
0.00
0.84
--
e
2.54BSC
L
3.00
--
--
All Dimensions in mm
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
287 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SIPAK (Type TH)
E
b3
D1
E1
L
A
k
c
b
D
H
A2
L3
L5
P
0
0
0
01
L4
L2
SIPAK (Type TH)
Dim
Min
Max
Typ
A
2.20
2.40
2.30
A2
0.97
1.17
1.07
b
0.68
0.90
0.78
b3
5.20
5.50
5.33
c
0.43
0.63
0.53
D
5.98
6.22
6.10
D1
5.30 REF
e
2.286 BSC
E
6.40
6.80
6.60
E1
4.63
5.03
4.83
H
10.00 11.44 11.22
k
0.40REF
L
3.90
4.30
4.10
L2
0.85
1.25
1.05
L3
0.88
1.28