Package_outline_dimensions_and_layout
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0.80
E
1.15
1.25
1.20
E2
0.40
0.60
0.50
L
0.25
0.35
0.30
L1
0.65
0.75
0.70
All Dimensions in mm
Suggested Pad Layout
U-DFN1212-3 (Type C)
Dimensions
Value
(in mm)
C
0.800
G
0.200
X
0.320
X1
0.520
X2
1.050
Y
0.450
Y1
0.250
Y2
0.850
A
A3
Seating Plane
A1
D
E
e
L1
b
b1
E2
D2
L
X2
Y2
Y
C
X
Y1
X1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
35 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1216-4
X1-DFN1216-4
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0.00
0.05
0.02
A3
--
--
0.13
b
0.15
0.25
0.20
D
1.15
1.25
1.20
D2
0.75
0.95
0.85
E
1.55
1.65
1.60
E2
0.55
0.75
0.65
e
-
-
0.65
L
0.20
0.30
0.25
Z
-
-
0.175
All Dimensions in mm
Suggested Pad Layout
X1-DFN1216-4
X1-DFN1216-4
Dimensions
Value
(in mm)
C
0.65
X
0.25
X1
0.90
Y
0.50
Y1
0.70
Y2
2.00
Z
A1
C'0.2x45°
D
D2
E
e
b
L
E2
A
A3
(Pin #1 ID)
Seating Plane
X1
Y2
Y1
Y
C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.