Package_outline_dimensions_and_layout
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Rev. 90
27 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN1010-6 (Type C)
X2-DFN1010-6
(Type C)
Dim Min Max
Typ
A
-
0.35
-
A1
-
0.04
-
b
0.12 0.20
0.15
D
0.95 1.050
1.00
E
0.95 1.050
1.00
e
0.35 BSC
e1
0.55 BSC
L3
0.27 0.30
0.30
L3a 0.32 0.40
0.35
All Dimensions in mm
Suggested Pad Layout
X2-DFN1010-6 (Type C)
Dimensions
Value
(in mm)
C
0.350
G
0.150
G1
0.150
X
0.200
X1
0.900
Y
0.500
Y1
0.525
Y2
0.475
Y3
1.150
A
A1
Seating Plane
D
E
b
e
L3(5x)
(Pin #1 ID)
L3a
e1
Pin1
X1
Y3
C
Y2
Y1
Y(4x)
X
G1
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
28 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN1114-3
W-DFN1114-3
Dim Min Max
Typ
A
0.77 0.83
0.80
A1
0
0.05
0.02
A3
-
-
0.152
b
0.25 0.35
0.30
D
1.05 1.15
1.10
D1 0.70 0.80
0.75
e
-
-
0.55
E
1.35 1.45
1.40
E1 0.66 0.76
0.71
L