KTY81-1SERIES_3
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handbook, full pagewidth
MBH795
(p)
A 1
P
H 2
A
L
H0
H1
F
F1
2
F
P2
P0
D0
W2
W0 W
1
W
t
t1
∆ h
∆ h
T
2000 Aug 25
11
Philips Semiconductors
Product specification
Silicon temperature sensors
KTY81-1 series
Fig.8 Configuration of bandolier: straight leads.
handbook, full pagewidth
MBL214
(p)
A 1
P
H 2
A
L
H0
H1
F
F1
2
F
P2
P0
D0
W2
W0 W
1
W
t
t1
∆ h
∆ h
T
2000 Aug 25
12
Philips Semiconductors
Product specification
Silicon temperature sensors
KTY81-1 series
Table 5
Tape specification
Note
1. Measured over 20 devices.
SYMBOL
DIMENSION
SPECIFICATIONS
REMARKS
MIN.
NOM.
MAX.
TOL.
UNIT
A1
body width
4.4
−
4.8
−
mm
A
body height
5
−
5.2
−
mm
T
body thickness
3.6
−
4.2
−
mm
P
pitch of component
−
12.7
−
±1
mm
P0
feed hole pitch
−
12.7
−
±0.3
mm
cumulative pitch error
−
−
−
±0.1
note 1
P2
feed hole centre to component
centre
−
6.35
−
±0.4
mm
to be measured at bottom
of clinch
F
lead-to-lead distance
spread leads
−
5.08
−
+0.6/
−0.2 mm
straight leads
−
2.54
−
+0.6/
−0.2 mm
∆h
component alignment
−
0
1
−
mm
at top of body
W
tape width
−
18
−
±0.5
mm
W0
hold-down tape width
−
6
−
±0.2
mm
W1
hole position
−
9
−
+0.7/
−0.5 mm
W2
hold-down tape position
−
0.5
−
±0.2
mm
H0
lead wire clinch height
−
16.5
−
±0.5
mm
H1
component height
−
−
23.25
−
mm
L
length of snipped leads
−
−
11
−
mm
D0
feed hole diameter
−
4
−
±0.2
mm
t
total tape thickness
−
−
1.2
−
mm
t1 = 0.3 to 0.6
F1, F2
lead to snipped lead distance
spread leads
−
2.54
−
+0.4/
−0.2 mm
straight leads
−
1.27
−
+0.4/
−0.2 mm
H2
clinch height
−
2.5
−
+0.5/0
mm
(p)
pull-out force
6
−
−
−
N
2000 Aug 25
13
Philips Semiconductors
Product specification
Silicon temperature sensors
KTY81-1 series
PACKAGE OUTLINE
UNIT
A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
5.2
5.0
b
0.48
0.40
c
0.45
0.40
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
0.7
0.5
e
2.54
L2
L1
(1)
max.
2.5
b1
0.66
0.56
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOD70
98-05-25
A
L
0
2.5
5 mm
scale
b
c
D
b1
L1
L2
d
E
Plastic near cylindrical single-ended package; 2 in-line leads
SOD70
1
2
e
2000 Aug 25
14
Philips Semiconductors
Product specification
Silicon temperature sensors
KTY81-1 series
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification