Package_outline_dimensions_and_layout
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C
0.500
D
0.258
X
1.000
Y
0.250
Y1
1.500
D
E
Pin #1 ID
b Ø(12x)
e
A2
A
SEATING PLANE
e
D2a
E2a
A
SD
SE
Y1
D Ø(12x)
C
C
X
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
244 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1608-2
X3-WLB1608-2
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
-
0.015
-
b
-
-
0.600
b1
-
-
0.600
D
1.57
1.63
1.60
E
0.77
0.83
0.80
K
-
-
0.282
L1
0.25
0.35
0.30
L2
0.90
1.00
0.95
All Dimensions in mm
Suggested Pad Layout
X3-WLB1608-2
Dimensions
Value
(in mm)
X
0.385
X1
1.035
X2
1.622
Y
0.690
D
E
b
b1
L1
K
L2
Seating Plane
A
A1
R=0.10
X2
X1
X
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.