Package_outline_dimensions_and_layout
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Rev. 90
239 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1406-2
X3-WLB1406-2
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
0.000 0.015
-
b
0.45
0.55
-
b1
0.45
0.55
-
D
1.37
1.43
1.40
E
0.57
0.63
0.60
k
-
-
0.30
L1
0.20
0.26
-
L2
0.70
0.80
-
All Dimensions in mm
Suggested Pad Layout
X3-WLB1406-2
Dimensions
Value
(in mm)
X
0.304
X1
0.840
X2
1.352
Y
0.580
L2
Seating Plane
A1
A
b1
D
b
L1
k
R = 100
E
X2
Y
X
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
240 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB1408-2
X3-WLB1408-2
Dim Min Max
Typ
A
0.25
0.30 0.275
A1
-
0.01
-
b
0.659 0.759 0.709
D
1.35 1.45
1.40
E
0.75 0.85
0.80
e
-
-
0.855
L
0.194 0.294 0.244
L1 0.615 0.715 0.665
Z1
0.16 0.076 0.046
Z2
0.16 0.076 0.046
All Dimensions in mm
Suggested Pad Layout
X3-WLB1408-2