Package_outline_dimensions_and_layout
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Value
(in mm)
C
0.400
D
0.260
C
C
Ø D (4x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
232 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-WLB1006-2
X2-WLB1006-2
Dim Min
Max
Typ
A
0.27
0.35
0.30
A1
00
0.03
0.02
b
0.459 0.559 0.509
D
0.95
1.05 1.000
E
0.55
0.65 0.600
e
-
-
0.578
L1 0.194 0.294 0.244
L2 0.369 0.469 0.419
Z1 0.016 0.076 0.046
Z2 0.016 0.076 0.046
All Dimensions in mm
Suggested Pad Layout
X2-WLB1006-2
Dimensions
Value
(in mm)
X
0.332
X1
0.507
X2
0.989
Y
0.579
Seating Plane
A1
A
E
D
b(2x)
L1
e
Z1
L2
Z2
X2
Y
X
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.