Package_outline_dimensions_and_layout
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Dimensions
Value
(in mm)
X
0.334
X1
0.755
X2
1.386
Y
0.789
L1
Z2
Seating Plane
A1
A
E
D
b(2x)
L
e
Z1
Pin#1 Cathode
Notch (R 0.100)
Cathode
Anode
X2
Y
X
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
241 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB1510-6
Suggested Pad Layout
U-WLB1510-6
Dimensions
Value
(in mm)
C
0.50
C1
1.00
D
0.25
D
E
e
e
e
A2
A
Seating Plane
Ø b (4x)
U-WLB1510-6
Dim
Min
Max
Typ
A
--
0.62
--
A2
--
--
0.038
b
0.27
0.37
0.32
D
1.40
1.50
1.50
E
0.90
1.00
1.00
e
--
--
0.50
All Dimensions in mm
C
C
D
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.