Package_outline_dimensions_and_layout
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
Rev. 90
230 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-WLB0808-4
X1-WLB0808-4
Dim
Min
Max
Typ
A
0.3320 0.4180 0.3750
A1
0.1350 0.1650 0.1500
A2
0.1750 0.2250 0.2000
A3
0.0220 0.0280 0.0250
b
0.1971 0.2409 0.2190
D
0.7900 0.8100 0.8000
E
0.7900 0.8100 0.8000
e
0.400 BSC
All Dimensions in mm
Suggested Pad Layout
X1-WLB0808-4
Dimensions
Value
(in mm)
C
0.4000
D
0.2190
C
C
Ø D (4x)
E
D
A2
A
Seating Plane
A1
e
e
Ø b (4x)
Pin1
A3(Backside Coating)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
231 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X3-WLB0808-4
Suggested Pad Layout
X3-WLB0808-4
D
E
A2 A
Seating Plane
A1
e
e
Ø b (4x)
Pin1
X3-WLB0808-4
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
0.000 0.020 0.010
A2
0.250 0.280 0.265
b
0.240 0.280 0.260
D
0.790 0.850 0.820
E
0.790 0.850 0.820
e
0.400 BSC
All Dimensions in mm
Dimensions