Package_outline_dimensions_and_layout
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© Diodes Incorporated
Package Outline Dimensions
X3-WLB0606-3
Suggested Pad Layout
X3-WLB0606-3
D
E
A2 A
Seating Plane
A1
k
e
Pin1
b(2x)
L1(2x)
L2
b2
X3-WLB0606-3
Dim
Min
Max
Typ
A
0.250 0.300 0.275
A1
0.000 0.020 0.010
A2
0.250 0.280 0.265
b
0.140 0.220 0.180
b2
0.450 0.550 0.500
D
0.595 0.645 0.620
E
0.595 0.645 0.620
e
--
--
0.320
k
--
--
0.140
L1
0.140 0.220 0.180
L2
0.140 0.220 0.180
All Dimensions in mm
Dimensions
Value
(in mm)
G
0.140
X
0.180
X1
0.500
Y
0.240
Y1
0.620
Y2
0.240
Y1
G
Y(2x)
Y2
X1
X(2x)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
228 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-WLB0808-4
U-WLB0808-4
Dim
Min
Max
Typ
A
0.511 REF
A2
0.336
0.366
0.351
A3
0.15
0.17
0.16
b
0.205
0.225
0.215
D
0.795
0.825
0.81
E
0.795
0.825
0.81
e
—
—
0.40
All Dimensions in mm
Suggested Pad Layout
U-WLB0808-4
Dimensions
Value
(in mm)
C
0.40
D
0.172
D
E
A2
A
SEATING PLANE