Package_outline_dimensions_and_layout
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Rev. 90
218 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT25F
TSOT25F
Dim
Min
Max
Typ
A
0.700 0.775 0.750
b
0.350 0.500
-
c
0.100 0.200
-
D
2.800 3.100 2.900
E
3.700 3.900 3.800
E1
1.500 1.700 1.600
e
-
-
0.950
e1
-
-
1.900
θ
4°
12°
10°
All Dimensions in mm
Suggested Pad Layout
TSOT25F
Dimensions
Value
(in mm)
C
0.950
C1
1.900
X
0.700
X1
2.600
Y
1.000
Y1
4.220
e1
E
e
E1
D
b
c
SEE VIEW C
A
VIEW C
0
(4x)
0
(4x)
Y1
C1
X1
C
X
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
219 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSOT26
TSOT26
Dim
Min
Max Typ
A
-
1.00
-
A1
0.01 0.10
-
A2
0.84 0.90
-
D
-
-
2.90
E
-
-
2.80
E1
-
-
1.60
b
0.30 0.45
-
c
0.12 0.20
-
e
-
-
0.95
e1
-
-
1.90
L
0.30 0.50
-
L2
-
-
.25
θ
0°
8°