Package_outline_dimensions_and_layout
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E1
4.30
4.50
4.40
e
0.65 BSC
L
0.45
0.75
0.60
L1
1.0 REF
θ1
0°
8°
-
θ2
10°
14°
12°
θ3
10°
14°
12°
All Dimensions in mm
Suggested Pad Layout
TSSOP-20
Dimensions
Value
(in mm)
C
0.650
X
0.420
X1
6.270
Y
1.780
Y1
4.160
Y2
7.720
e
D
E
E1
A2
A
A1
b
DETAIL
Seating Plane
Gauge Plane
0.25
L
L1
ID MARK
PIN 1
Y1
Y2
Y
X
C
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
216 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-20EP
TSSOP-20EP
Dim
Min
Max
Typ
A
-
1.20
-
A1
0.025 0.100
-
A2
0.80
1.05
0.90
b
0.19
0.30
-
c
0.09
0.20
-
D
6.40
6.60
6.50
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
L
0.45
0.75
0.60
L1
1.0 REF
L2
0.65 BSC
X
-
-
4.191
Y
-
-
2.997
θ1
0°
8°
-
All Dimensions in mm
Suggested Pad Layout
TSSOP-20EP
Dimensions
Value
(in mm)
C
0.650
X
0.420
X1
4.490
X2
6.270
Y
1.780
Y1
3.290
Y2
4.160
Y3
7.720
ID MARK
PIN 1
e
D
E
E1
A2
A
A1
b
X
Y
DETAIL
Seating Plane