Package_outline_dimensions_and_layout
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c
0.356 0.47 0.381
c2
1.22
1.32
1.27
D
8.60
8.80
8.70
D1
6.60
7.80
7.60
D1a
5.33
6.53
6.33
D1b
4.54
5.74
5.54
e
2.54 BSC
E
10.00 10.20 10.10
E1
6.67
7.87
7.67
E1a
4.94
6.14
5.94
E1b
7.06
8.26
8.06
H
14.70 15.50 15.10
L
2.00
2.60
2.30
L1
1.17
1.40
1.27
L2
1.45
1.70
1.55
L3
0.25 BSC
L4
2.50 REF
θ
0°
8°
5°
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
Suggested Pad Layout
TO263AB (D2PAK)
Dimensions Value (in mm)
C
5.08
X
1.10
X1
10.41
Y
3.50
Y1
7.01
Y2
15.99
E
L1
D
b2
b
e
L2
c2
A
H
See Detail B
01
c
E1
A1
Gauge Plane
L
L3
0
Detail B
Seating
Plane
E1b
D1
E1a
D1a
D1b
A2
L4
01
02
Ø1
.50
X1
Y
Y2
C
X
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
209 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO263-5
TO263-5
Dim
Min
Max
A
4.07
4.85
A1
1.14
1.40
b
0.66
1.02
c
0.36
0.64
D
8.65
9.65
E
9.78
10.54
e
1.57
1.85
L
14.61
15.88
L1
2.29
2.79
L2
-
2.92