Package_outline_dimensions_and_layout
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C
5.08
X
1.10
X1
10.41
Y
3.50
Y1
7.01
Y2
15.99
X1
Y1
Y2
C
X
Y
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
205 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO263AB Type B (D
2PAK)
TO263AB (D2PAK)
(Type B)
Dim
Min
Max
Typ
A
4.40
4.70
4.57
A1
0.00
0.20
0.10
A2
2.59
2.79
2.69
b
0.77
0.90 0.813
b2
1.20
1.36
1.27
c
0.356 0.47 0.381
c2
1.22
1.32
1.27
D
8.60
8.80
8.70
D1
6.60
7.80
7.60
D1a
5.33
6.53
6.33
D1b
4.54
5.74
5.54
e
2.54 BSC
E
10.00 10.20 10.10
E1
6.67
7.87
7.67
E1a
4.94
6.14
5.94
E1b
7.06
8.26
8.06
H
14.70 15.50 15.10
L
2.00
2.60
2.30
L1
1.17
1.40
1.27
L2
1.45
1.70
1.55
L3
0.25 BSC
L4
2.50 REF
θ
0°
8°
5°
θ1
5°
9°
7°
θ2
1°
5°
3°
All Dimensions in mm
Suggested Pad Layout
TO263 Type B (D
2PAK)
Dimensions
Value
(in mm)
C
5.08
X
1.10
X1
10.41
Y
3.50
Y1
7.01
Y2
15.99
E
L1
D
b2
b
e
L2
c2
A
H
See Detail B
01
c