Package_outline_dimensions_and_layout
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A2 0.97 1.17
1.07
A4
0.10 REF
b
0.72
0.85
0.78
b3
5.23
5.45
5.33
c
0.47
0.58
0.53
D
6.00
6.20
6.10
D1
5.30 REF
e
2.286 BSC
E
6.50
6.70
6.60
E1 4.70 4.92
4.83
H
9.90 10.10 10.30
L
1.40
1.70
1.60
L2
0.51 BSC
L3
0.90
1.25
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L4
0.60
1.00
0.80
L5
1.70
1.90
1.80
a
0°
8°
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All Dimensions in mm
Suggested Pad Layout
TO252 Type B (DPAK)
Dimensions Value (in mm)
C
4.572
X
1.060
X1
5.632
Y
2.600
Y1
5.700
Y2
10.700
c
A
7°±2°
H
Seating Plane
A1
Gauge Plane
a
L
2.90REF
A2
A4
L5
7°±2°
7°±2°
b3
E
L3
D
L4
b(3x)
e
D1
E1
Ø1.20
0
L2
X1
X
Y2
Y1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
199 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO252 (DPAK) (Type BR)
TO252 (DPAK)
(Type BR)
Dim Min
Max
Typ
A
2.20
2.40
-
A1 0.00
0.10
-
b
0.50
0.70
-
b3
5.20
5.40
-
c
0.45
0.55
-
D
5.95
6.25
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D1 5.10
5.50
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E
6.45
6.70
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E1 4.71
4.91
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e
2.24
2.34