Package_outline_dimensions_and_layout
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Rev. 90
197 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO252 (DPAK)
TO252 (DPAK)
Dim Min
Max
Typ
A
2.19
2.39
2.29
A1 0.00 0.13
0.08
A2 0.97 1.17
1.07
b
0.64
0.88 0.783
b2
0.76
1.14
0.95
b3
5.21
5.46
5.33
c
0.45
0.58 0.531
D
6.00
6.20
6.10
D1 5.21
-
-
e
-
-
2.286
E
6.45
6.70
6.58
E1 4.32
-
-
H
9.40 10.41 9.91
L
1.40
1.78
1.59
L3
0.88
1.27
1.08
L4
0.64
1.02
0.83
a
0°
10°
-
All Dimensions in mm
Suggested Pad Layout
TO252 (DPAK)
Dimensions Value (in mm)
C
4.572
X
1.060
X1
5.632
Y
2.600
Y1
5.700
Y2
10.700
b3
E
L3
D
L4
b2(2x)
b(3x)
e
c
A
7°±1°
H
Seating Plane
A1
Gauge Plane
a
0.508
L
2.74REF
D1
A2
E1
X1
X
Y2
Y1
Y
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
198 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO252 Type B (DPAK)
TO252 (DPAK)
(Type B)
Dim Min
Max
Typ
A
2.20
2.38
2.30
A1 0.00 0.10