Package_outline_dimensions_and_layout
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1.05
L1 0.327 0.527 0.427
z
0.20 0.40
0.30
All Dimensions in mm
Suggested Pad Layout
SOT89
Dimensions
Value
(in mm)
C
1.500
G
0.244
X
0.580
X1
0.760
X2
1.933
Y
1.730
Y1
3.030
Y2
1.500
Y3
0.770
Y4
4.530
H1
E
H
D1
B
e
c
L
A
D
8° (
4X)
D2
E2
z
L1
R0.2
00
B1
Y4
X2
Y1
X
Y
Y2
Y3
G
C
X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
196 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT89-5
SOT89-5
Dim
Min
Max
Typ
A
1.40
1.60
1.50
B
0.50
0.62
0.56
B1
0.44
0.54
0.48
C
0.35 0.43
0.38
D
4.40
4.60
4.50
D1
1.62
1.83
1.733
E
2.40
2.60
2.50
e
-
-
1.50
H
3.95
4.25
4.10
L
0.65
0.95
0.80
All Dimensions in mm
Suggested Pad Layout
SOT89-5
Dimensions
Value
(in mm)
C
1.500
C1
1.050
X
0.680
X1
0.760
X2
1.930
X3
3.680
Y
1.200
Y1
1.200
Y2
4.250
Y3
4.500
E
H
D1
B1
B
e
C
L
A
D
8° (4x)
R0.200
L
X3
X
Y
Y3
X1
X2
C
Y2
Y1
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.