Package_outline_dimensions_and_layout
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a
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
SOT543
Dimensions
Value
(in mm)
C
0.500
X
0.300
Y
0.670
Y1
0.550
Y2
1.940
E1/2
E1
D
TYP.
R0.1 MAX.
a
L1
7°
TYP.
A
E/2
E
b
e
e1
L
c
C
Y2
X
Y
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
190 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
SOT553
SOT553
Dim Min
Max Typ
A
0.55 0.62 0.60
b
0.15 0.30 0.20
c
0.10 0.18 0.15
D
1.50 1.70 1.60
E
1.55 1.70 1.60
E1
1.10 1.25 1.20
e
0.50 BSC
e1
1.00 BSC
F
0.00 0.10
––
L
0.10 0.30 0.20
a
6°
8°
7°
All Dimensions in mm
Suggested Pad Layout
SOT553
Dimensions
SOT553
Z
2.2
G
1.2
X
0.375
Y
0.5
C1
1.7
C2
0.5
E1/2
E1
D
TYP.
R0.1 MAX.
a
A
E/2
E
b (5x)
e
e1
L (5x)
c
F
7°
TYP.
X
Z
Y
C1
C2
C2
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.