Package_outline_dimensions_and_layout
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Rev. 90
214 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-16EP
TSSOP-16EP
Dim
Min
Max
Typ
A
-
1.20
-
A1
0.025 0.100
-
A2
0.80
1.05
0.90
b
0.19
0.30
-
c
0.09
0.20
-
D
4.90
5.10
5.00
E
6.20
6.60
6.40
E1
4.30
4.50
4.40
e
0.65 BSC
L
0.45
0.75
0.60
L1
1.0 REF
L2
0.65 BSC
X
-
-
2.997
Y
-
-
2.997
θ1
0°
8°
-
All Dimensions in mm
Suggested Pad Layout
TSSOP-16EP
Dimensions
Value
(in mm)
C
0.650
X
0.450
X1
3.290
X2
5.000
Y
1.450
Y1
3.290
Y2
4.450
Y3
7.350
ID MARK
PIN 1
DETAIL
Seating Plane
Gauge Plane
0.25
X
Y
E
E1
D
e
b
A1
A2
A
L
L1
Y2
Y
Y3
C
Y1
X2
X1
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
215 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TSSOP-20
TSSOP-20
Dim
Min
Max
Typ
A
-
1.20
-
A1
0.05
0.15
-
A2
0.80
1.05
-
b
0.19
0.30
-
c
0.09
0.20
-
D
6.40
6.60
6.50
E
6.20
6.60
6.40