Package_outline_dimensions_and_layout
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
0.30
L1
0.52
0.72
0.62
Z
—
—
0.175
All Dimensions in mm
D
E
e
b(6X)
L(2X)
A
A3
Z(4X)
A1
L1
b1
E2
D2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
47 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X1-DFN1616-6 (Type E)
X1-DFN1616-6
Type E
Dim
Min
Max
Typ
A
0.47
0.53
0.50
A1
0
0.05
0.02
A3
—
—
0.13
b
0.20
0.30
0.25
b1
0.10
0.30
0.20
D
1.55
1.65
1.60
D2
0.57
0.77
0.67
E
1.55
1.65
1.60
E2
1.30
1.50
1.40
e
—
—
0.50
L
0.25
0.35
0.30
L1
0.52
0.72
0.62
Z
—
—
0.175
All Dimensions in mm
Suggested Pad Layout
X1-DFN1616-6 (Type E)
Dimensions
Value
(in mm)
C
0.500
X
0.300
X1
0.200
X2
0.720
X3
0.400
Y
0.475
Y1
0.620
Y2
1.900
X (6x)
C
Y (2x)
Y2
X1
Y1
X2
X3
D
E
e
b(6X)
L(2X)
A
A3
Z(4X)
A1
L1
b1
E2
D2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.