Package_outline_dimensions_and_layout
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
L
0.25 0.35 0.30
Z
-
-
0.125
Z1
-
-
0.075
All Dimensions in mm
Suggested Pad Layout
X2-DFN2015-6
X2-DFN2015-6
Dimensions
Value
(in mm)
C
0.500
X
0.350
X1
1.150
X2
1.350
Y
0.500
Y1
0.850
Y2
2.150
A
A1
A3
Seating Plane
E
D2
E2
b
(Pin #1 ID)
e
L
D
z
R0.20
0
z1
C
X
Y2
X1
X2
Y
Y1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
53 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2015-8
X2-DFN2015-8
Dim Min Max Typ
D
1.95 2.05 2.00
E
1.45 1.55 1.50
D1
0.23 0.43 0.33
E1
0.55 0.75 0.65
D2
0.52 0.72 0.62
E2
0.38 0.58 0.48
D3
0.40 0.60 0.50
E3
0.35 0.55 0.45
A
-
0.40 0.39
A1
0
0.05 0.02
A3
-
-
0.127
b
0.20 0.30 0.25
L
0.25 0.35 0.30
e
-
-
0.65
Z
-
-
0.225
All Dimensions in mm
Suggested Pad Layout
X2-DFN2015-8
Dimensions Value (in mm)
C
0.650
G
0.150
G1
0.150
X
0.410
X1
0.350
X2
0.795
X3
0.700
Y
0.825