Package_outline_dimensions_and_layout
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Y
0.600
Y1
0.450
Y2
1.100
Y3
0.450
Y4
2.300
Y4
X3
X
Y
G
X1
Y1
R0.
200
R0.
225
C
Y2
X2
Y3
R0.050
R0.
200
D
D2
E
e
b
L
E2
A
A1
A3
Seating Plane
Pin #1 ID
R0
.200
E3
D3
L
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
58 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
U-DFN2020-3 (Type B)
U-DFN2020-3
(Type B)
Dim
Min
Max
Typ
A
0.57
0.63
0.60
A1
0.00
0.05
0.02
A3
––
––
0.152
b
0.20
0.30
0.25
D
1.950 2.075
2.00
D2
1.22
1.42
1.32
D4
0.56
0.76
0.66
E
1.950 2.075
2.00
E2
0.79
0.99
0.89
E4
0.48
0.68
0.58
e
––
––
0.65
L
0.25
0.35
0.30
Z
––
––
0.225
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-3 (Type B)
Dimensions
Value
(in mm)
C
1.300
G
0.240
X
0.350
X1
1.520
X2
1.700
Y
0.500
Y1
0.470
Y2
1.090
D
D2
E
e
b
E2
A
A1
A3
Seating Plane
L
e
E4
Z
D4
X
Y1
Y2
X1
C
Y
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.