Package_outline_dimensions_and_layout
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Rev. 90
66 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-6 (Type F)
Dimensions
Value
(in mm)
C
0.650
X
0.400
X1
0.480
X2
0.950
X3
1.700
Y
0.425
Y1
0.800
Y2
1.150
Y3
1.450
Y4
2.300
Pin1
Y4
Y2
Y
X
C
X3
Y1
X1
X2
Y3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
67 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
X2-DFN2020-6
X2-DFN2020-6
Dim
Min
Max
Typ
A
0.40
A1
0
0.05
0.03
A3
0.13
b
0.25
0.35
0.30
D
1.95
2.05
2.00
D2
0.85
1.05
0.95
E
1.95
2.05
2.00
E2
1.40
1.60
1.50
e
0.65
L
0.25
0.35
0.30
L1
1.35
1.45
1.40
Z
0.20
All Dimensions in mm
Suggested Pad Layout
X2-DFN2020-6
Dimensions
Value
(in mm)
C
0.650
X
0.400
X1
1.050
X2
1.700
Y
0.500
Y1
1.600
Y2
1.600
Y3
2.300
D
D2
E
e
b(6X)
L
E2
A
A3
A1
Z(3X)
L1
e
Y1
Y
Y3
X2
X1
X (6x)
C
Y2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.