Package_outline_dimensions_and_layout
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1.950 2.075
2.00
E2
0.80
1.00
0.90
L
0.25
0.35
0.30
z
-
-
0.125
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-8 (Type E)
Dimensions
Value
(in mm)
C
0.500
G
0.150
X
0.350
X1
1.800
X2
1.850
Y
0.500
Y1
1.000
Y2
2.300
A
A1
A3
Seating Plane
D
D2
E
e
b
L
E2
E2/2
Pin #1 ID
z
D2/2
R0.
200
R0.
120
X2
Y2
X
Y
C
Y1
X1
G
G
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
70 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
W-DFN2020-6 (Type US)
W-DFN2020-6
(Type US)
Dim
Min
Max
Typ
A
0.70
0.80
0.75
A1
0.00
0.05
--
A3
0.20 REF
b
0.25
0.35
0.30
D
1.95
2.075
2.00
D2
1.35
1.60
1.50
E
1.95
2.075
2.00
E2
0.65
0.90
0.80
e
0.65 BSC
L
0.25
0.45
0.35
All Dimensions in mm
Suggested Pad Layout
W-DFN2020-6 (Type US)
Dimensions
Value
(in mm)
C
0.650
X
0.350
X1
1.650
X2
1.550
Y
0.545
Y1
0.850
Y2
2.350
D
D2
E
e
b
L
E2
A
A1
A3
Seating Plane
Pin #1 ID
Y2
X1
X2
Y1
Y
X
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.