Priklady_vicevrstvych_DPS
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RCC
Dielectric 60um
Laser 125um
Dielectric 90um
Laser 125um
ARAMID
FR-4 / High Tg FR-4
Dielectric 60um
Laser 125um
Dielectric 35um
Laser 50um
Shape of Micro-via
Insulation Film
Dielectric 60um
Laser 125um
Dielectric 60um
Laser 250um
Dielectric 60um
Laser 250um
2-Layer Build up
L1-2, 2-3 / CO2
L1-2-3 / CO2
L1-2-3 / Yag
Shape of Micro-via
Filled Via
Plugged via & Capped Via
/ Pad on via
Shape of Filled via
Dielectric 60um
Laser 100um
Metal cap(2’st copper plating 13um)
Mechanical drill 200um / Finished 125um
Lamination
Laser
Conformal
Cu Plating
Lamination
Laser
CNC
Conformal
Imaging
Cu Plating
Imaging
Process of Stack Via With Filling Method
Process of Normal Stack Via
Lamination
Lamination
Laser
CNC
Conformal
Imaging
Cu Plating
Imaging
Process of Stacked via (Filled via)
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : NoteBook Wireless PCMCIA Card
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : NoteBook Wireless PCMCIA Card
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone
Layer & Thick : 8Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : Cellular Phone
Layer & Thick : 8Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone(ARAMID)
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
Application : Cellular Phone(ARAMID)
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : GSM Cellular Phone
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
Application : GSM Cellular Phone
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : GSM Cellular Phone
Layer & Thick : 7Layers, 1.6mm
Min.Hole Size : 0.15mm
Application : GSM Cellular Phone
Layer & Thick : 7Layers, 1.6mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
Application : Cellular Phone
Layer & Thick : 8Layers, 1.27mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : PCMCI
Layer & Thick : 8Layers, 1.10mm
Min.Hole Size : 0.15mm
Application : PCMCI
Layer & Thick : 8Layers, 1.10mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : NoteBook DVD & CD R/W
Layer & Thick : 4Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : NoteBook DVD & CD R/W
Layer & Thick : 4Layers, 0.8mm
Min.Hole Size : 0.15mm
H
G
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : OSP Test Board
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm